Insulating cells


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	SEMICONDUCTOR DEVICES Insulating cells

	IGBT & SFRD modules

	Diode-thyristor modules

	Thyristors

	Symmetric thyristors (Triacs)

	Reverse switched dynistors

	Diodes

	Silicon surge voltage suppressors

	Heatsinks

	Air cooling heatsinks for stud design devices

	Air cooling heatsinks for press pack devices

	Fluid cooling heatsinks for stud design devices

	Fluid cooling heatsinks for press pack devices

	Air cooling heatsinks for power module

	High efficiency heatsinks for power module

	Fluid cooling heatsinks for power modules

	Clamping arrangements for press pack diodes and thyristors

	Insulation elements

	Module design insulated temperature sensors analogue TMBA1.6, digital TMBC 4.6

INSULATION ELEMENTS

Features and application fields:

▪ Insulation elements are designed for insulation of press pack devices from cooling systems, allowing to place some devices on the same heatsink and to simplify converter design
▪ Optimum design for low thermal resistance
▪ Plastic housing, heat conductive insulation Al2O3 or AlN

Type	Overall dimensions, mm	w, g	Thermal resistance (insulation material) , ºC/W	F, kN	V_isol(effective value), kV
IT40	17х80	195	0,172 (Al₂O₃)	13÷16	10
IT60	17х116х136	490	0,151 (Al₂O₃)	24÷28	10
IT60M	17х116х136	490	0,075 (AlN)	24÷28	10

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