Heatsinks

	SEMICONDUCTOR DEVICES Heatsinks

	IGBT & SFRD modules

	Diode-thyristor modules

	Thyristors

	Symmetric thyristors (Triacs)

	Reverse switched dynistors

	Diodes

	Silicon surge voltage suppressors

	Heatsinks

	Air cooling heatsinks for stud design devices

	Air cooling heatsinks for press pack devices

	Fluid cooling heatsinks for stud design devices

	Fluid cooling heatsinks for press pack devices

	Air cooling heatsinks for power module

	High efficiency heatsinks for power module

	Fluid cooling heatsinks for power modules

	Clamping arrangements for press pack diodes and thyristors

	Insulation elements

	Module design insulated temperature sensors analogue TMBA1.6, digital TMBC 4.6

CLAMPING ARRANGEMENTS FOR PRESS PACK DIODES AND THYRISTORS

Features and application fields

▪ These arrangements clamp press pack devices to heatsinks. Contact surface diameters from 19 mm up to 100 mm

▪ Homogeneous pressure is provided

▪ Controllable clamping force

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