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SEMICONDUCTOR DEVICES
Heatsinks
IGBT & SFRD modules
Diode-thyristor modules
Thyristors
Symmetric thyristors (Triacs)
Reverse switched dynistors
Diodes
Silicon surge voltage suppressors
Heatsinks
Air cooling heatsinks for stud design devices
Air cooling heatsinks for press pack devices
Fluid cooling heatsinks for stud design devices
Fluid cooling heatsinks for press pack devices
Air cooling heatsinks for power module
High efficiency heatsinks for power module
Fluid cooling heatsinks for power modules
Clamping arrangements for press pack diodes and thyristors
Insulation elements
Module design insulated temperature sensors analogue TMBA1.6, digital TMBC 4.6
Air cooling heatsinks for power modules


▪ For power modules with currents of 40, 63, 80, 100, 125, 160, 200 À

▪ Heatsinks with different length are available

 

Type w R thha (P F) Δph

   For cases

convection Vcfh=6m/s Vcfh=6m/s
g ºC/W ºC/W Pa
O24 590  2.10(25)  0,48  25  MTD1, MTD2 
O25 2170 0.75(80) 0.21 18 MI3, MI3-1
O26 2180 0.74(85) 0.20 30 MTD3
O34 0720 1.20(50)  0.31 25 MTD1, MTD2
O35 1260 1.10(60) 0.23 30 MI3, MI3-1
O36 990 1.15(55) 0.28 30 MTD3
O45 1020 1.10(55) 0.23 30 MI3, MI3-1
O46 2580 0.55(100) 0.18 30 MTD3
O47 3250 0.40(150) 0.105 30 MTD5

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430001, Russia,
Rep. Mordovia, Saransk,
Proletarskaya Str., 126
Ph./Fax.   (8342) 47-04-30
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