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SEMICONDUCTOR DEVICES
Heatsinks
IGBT & SFRD modules
Diode-thyristor modules
Thyristors
Symmetric thyristors (Triacs)
Reverse switched dynistors
Diodes
Silicon surge voltage suppressors
Heatsinks
Air cooling heatsinks for stud design devices
Air cooling heatsinks for press pack devices
Fluid cooling heatsinks for stud design devices
Fluid cooling heatsinks for press pack devices
Air cooling heatsinks for power module
High efficiency heatsinks for power module
Fluid cooling heatsinks for power modules
Clamping arrangements for press pack diodes and thyristors
Insulation elements
Module design insulated temperature sensors analogue TMBA1.6, digital TMBC 4.6
Flud cooling heatsinks for stud design devices

▪ For one-side cooling of stud design devices series 161, 261, 361 (heatsink OM101 series 171, 271, 371 (heatsink OM102))

▪ For water/fluid cooling

Short parameters:

Type w Thread

R thha (water flow rate 3 l/min)

Δph,  (water flow rate 3 l/min)

For cases

g ºC/W Pa
OM101 680 Ì20õ1.5 0.110 7000  SD6, ST6
OM105 710 M24x1.5 0.085 11000 SD7, ST7

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JSC Electrovipryamitel
430001, Russia,
Rep. Mordovia, Saransk,
Proletarskaya Str., 126
Ph./Fax.   (8342) 47-04-30
          (8342) 47-15-01
E-mail: vpruvs@moris.ru
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