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SEMICONDUCTOR DEVICES
Heatsinks
IGBT & SFRD modules
Diode-thyristor modules
Thyristors
Symmetric thyristors (Triacs)
Reverse switched dynistors
Diodes
Silicon surge voltage suppressors
Heatsinks
Air cooling heatsinks for stud design devices
Air cooling heatsinks for press pack devices
Fluid cooling heatsinks for stud design devices
Fluid cooling heatsinks for press pack devices
Air cooling heatsinks for power module
High efficiency heatsinks for power module
Fluid cooling heatsinks for power modules
Clamping arrangements for press pack diodes and thyristors
Insulation elements
Module design insulated temperature sensors analogue TMBA1.6, digital TMBC 4.6
FLUID COOLING HEATSINKS FOR PRESS PACK DEVICES

Features and typical applications:

▪ For one-side and double-side cooling of press pack devices

▪ For water/fluid cooling


Type

w

Contact surface diameter R thha (water flow rate 3 l/min) Δph (water flow rate 3 l/min)

                  For cases

g mm ˚Ñ/Âò Pa
OM103 2000 50 0.0600 9000 PD32,PD33, PT31,PT31-1,PT32 
OM104 2300 50 0.0300 18000 PD42,PD43, PT41,PT42,PT43 

OM106

3600 58 0.0200 18000 PD53PT51, PT53-1,PT53 
OM107 10000 78 0.0140 8000  PD73, PT73
OM207 10000 78 0.0095 16000 PD73, PT73
OM108 11000 86  0.0130 9000 PD73, PT73 
OM109 14000 102 0.0110 9000 PD83, PT83 

OM209

14000 102 0.0085 16000 PD94PT83,PT93,PT94


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430001, Russia,
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Proletarskaya Str., 126
Ph./Fax.   (8342) 47-04-30
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